Title:
PROCESS FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2006324376
Kind Code:
A
Abstract:
To provide a process for producing a printed wiring board used in various electronic apparatus in which the circuit pattern and solder resist can be formed with extremely excellent alignment accuracy.
Since heat treatment at a temperature of glass transition point or above of a substrate is performed after forming resist in a process following a process for forming a circuit pattern, solder resist can be formed under a state of good dimensional stability of the substrate and thereby the circuit pattern and solder resist can be formed with extremely excellent alignment accuracy.
Inventors:
UEHARA HAJIME
Application Number:
JP2005144988A
Publication Date:
November 30, 2006
Filing Date:
May 18, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K3/28; H05K3/38
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito
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