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Patent Searching and Data


Title:
PROCESSING APPARATUS AND PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2015191880
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a processing apparatus capable of efficiently performing drying treatment and burning treatment for an organic material film applied onto a substrate.SOLUTION: An electromagnetic wave irradiation device 5 for irradiating an organic material film with electromagnetic waves comprises: an electromagnetic wave source 21; an antenna part 23 which guides electromagnetic waves generated by the electromagnetic wave source 21 into a processing vessel 1; a waveguide 25 which connects the electromagnetic wave source 21 and the antenna part 23 to each other; and a transmissive cover 27 which covers the antenna part. In a processing apparatus 100, radiation antennas 35 each having a plurality of slots 33 are arranged in a plurality of rows so as to constitute the antenna part 23. This makes it possible to planarly emit the electromagnetic waves from the antenna part 23 toward a substrate S facing the antenna part 23 according to the area of the substrate S.

Inventors:
SHIMIZU MASAHIRO
Application Number:
JP2014070846A
Publication Date:
November 02, 2015
Filing Date:
March 31, 2014
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H05B33/10; F26B23/08; H01L51/50; H05B6/68; H05B6/72; H05B6/80
Domestic Patent References:
JP2007258286A2007-10-04
JP2013148786A2013-08-01
JP2011233426A2011-11-17
JP2005268624A2005-09-29
Foreign References:
WO2005094132A12005-10-06
Attorney, Agent or Firm:
渡邊 和浩
星宮 勝美
城澤 達哉