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Title:
PROCESSING OF COMPOUND SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH02188918
Kind Code:
A
Abstract:

PURPOSE: To process a compound semiconductor with little damage in a comparatively short time and to directly draw a pattern by using focused accelerating electrons by a method wherein the surface of the compound semiconductor is irradiated with a hydrocarbon gas as a reactive gas and is irradiated with accelerating electrons.

CONSTITUTION: The surface of a compound semiconductor 4 is irradiated with a hydrocarbon gas as a reactive gas and is irradiated with accelerating electrons 11; and thereby, a region, irradiated with the accelerating electrons, of the compound semiconductor 4 is processed. For example, a deflector used to scan an electron beam 11 and its control apparatus are added to a processing apparatus, as shown in the figure, composed of the following: an electron-beam generation part 1 with which a compound semiconductor 4 is irradiated with the electron beam 11 through an electron lens for electron-beam focusing use; a nozzle 2 with which a compound semiconductor 4 is irradiated with a hydrocarbon compound; a vacuum container 10; a stage 5; and an evacuation part 7. GaAs is used as the compound semiconductor 4; CH4 is used as a reactive gas; and a prescribed region is removed from the surface of the compound semiconductor 4 by using the electron beam accelerated at an accelerating voltage of 10kV.


Inventors:
HIDAKA HIROMI
TANETANI MOTOTAKA
SUGIMOTO YOSHIMASA
AKITA KENZO
Application Number:
JP593589A
Publication Date:
July 25, 1990
Filing Date:
January 17, 1989
Export Citation:
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Assignee:
HIKARI GIJUTSU KENKYU KAIHATSU
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/302
Attorney, Agent or Firm:
Tan Ashida (2 outside)