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Title:
PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2019055450
Kind Code:
A
Abstract:
To replace and add a cooling mechanism without adjusting belt tension and shorten a work time.SOLUTION: A processing device includes holding means 2 for holding a wafer W. The holding means 2 has a holding table 20 for holding the wafer W, a rotary shaft 21 for rotating the holding table 20, a motor 24 for rotating the rotary shaft 21, transmission means 25 for transmitting rotating force of the motor 24 to the rotary shaft 21, and a cooling jacket 27 for cooling a motor bracket 26. The cooling jacket 27 has a cooling water passage which is brought into contact with the motor bracket 26 and passes cooling water therein, thereby enabling easy detachment of the cooling jacket 27 with respect to the motor bracket 26 without removing the motor bracket 26 together with the motor 24 from a device base 10, for instance. Therefore, adjustment of belt tension becomes unnecessary and a work time can be shortened.SELECTED DRAWING: Figure 2

Inventors:
GENOEN JIRO
RYU DAIRYOKU
Application Number:
JP2017181135A
Publication Date:
April 11, 2019
Filing Date:
September 21, 2017
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B24B7/04; B24B47/12; H01L21/683
Domestic Patent References:
JP2017042875A2017-03-02
JP2003025198A2003-01-29
JP2016112635A2016-06-23
JPH05285781A1993-11-02
JP2008006535A2008-01-17
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office



 
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