Title:
PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2023015782
Kind Code:
A
Abstract:
To maintain a high processing quality while suppressing movement of processing waste toward a back surface of a substrate.SOLUTION: A processing device includes: a holding table 10 having a holding surface 11 for holding a back-surface side of a substrate; and a processing unit that processes a substrate held on the holding surface 11. The holding surface 11 has: a holding portion 12 that holds a central area of the substrate 100; a discharge groove 15 surrounding the holding portion 12; and an outer peripheral groove 18 surrounding the discharge groove 15 and communicating with a suction source to suck and hold the substrate. The processing device collects processing waste, generated by the processing unit, in the discharge groove 15.SELECTED DRAWING: Figure 4
Inventors:
YANG YUNFENG
Application Number:
JP2021119765A
Publication Date:
February 01, 2023
Filing Date:
July 20, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B55/06; B23Q3/08; B23Q11/00; B24B5/04; B24B41/06; B24B55/02; H01L21/304; H01L21/683
Attorney, Agent or Firm:
Sakai International Patent Office
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