PURPOSE: To prevent the holding surface for objects to be processed from being contaminated by adhesion of particles, etc., due to a loading member held by a rotary holding means, and thereby improve the yield.

CONSTITUTION: An uneven holding part 34 having a projected loading face 34a for a semiconductor wafer W is provided on a spin-chuck 30 rotating with the semiconductor wafer W held, and a sucking hole 35 connected to a sucking means for sucking the semiconductor wafer W is provided. An rugged leg part 21 which is engaged with a recessed part 37 of the holding part 34 in non- contact manner with the loading face 34a of the holding part 34 is provided on the underside of a washing jig 20 held on the spin-chuck 30. Further, a projected leg part 25a formed of a ring-like projected part surrounding at least the sucking hole 35 is provided on the rugged leg part 21. Thus, the washing jig 20 can be held with no contact with the loading face of the holding part 34 of the spin-chuck 30, and adhesion of particles, etc., adhering to the underside of the washing jig 20 to the loading face 34a of the spin-chuck 30 can be prevented.