Title:
加工装置及び保持部材
Document Type and Number:
Japanese Patent JP6791275
Kind Code:
B2
Abstract:
A processing device includes a mounting portion, a holding member configured to hold the target object, a first mover configured to move a mounting portion, a second mover configured to move the mounting portion and the holding member, a processor, and a memory. The processing device performs processing on a target object by penetrating the target object using a processing tool mounted to the mounting portion. The processor acquires processing data representing control conditions of the first mover and the second mover for causing the processing tool to penetrate the target object and perform processing on the target object. The processor controls the first mover and the second mover, on the basis of the acquired processing data, in a state in which the target object is held by the first holder, to cause the processing tool to penetrate the target object and perform the processing on the target object.
Inventors:
Hiroki Mori
Daisuke Abe
Daisuke Abe
Application Number:
JP2019005233A
Publication Date:
November 25, 2020
Filing Date:
January 16, 2019
Export Citation:
Assignee:
Brother Industries, Ltd.
International Classes:
B26D5/00; B26D5/34; B26D7/02; B26D7/20; B26D7/26; B26F1/24
Domestic Patent References:
| JP2013202706A | ||||
| JP2004130400A | ||||
| JP4212898A | ||||
| JP2012206232A | ||||
| JP2013091133A |
Attorney, Agent or Firm:
Hisashi Yamamoto
Tomohiro Inayama
Tomohiro Inayama