Title:
PROCESSING EQUIPMENT AND PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2018079540
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a piece of processing equipment or the like which is more accurate and saves time or cost with respect to the processing before a surface hardening treatment, a surface hardening treatment, and the finish processing after a surface hardening treatment.SOLUTION: A piece of processing equipment 1 comprises a cutting tool 12 that processes a clamped workpiece W, a hardening unit 16 capable of emitting a laser beam L, and an oscillation cutting unit 20 capable of oscillating a tip end part 60 loaded with an oscillation cutting unit 61, where the cutting tool 12, the hardening unit 16, and the oscillation cutting unit 20 are movable relatively to the workpiece W, the cutting tool 12 cutting the workpiece W before hardening, the hardening unit 16 performing a laser hardening of the workpiece W as a surface hardening treatment, and the oscillation processing unit 60 performing a finish W after hardening by applying the oscillation cutting tool 61 while being oscillated.SELECTED DRAWING: Figure 1
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Inventors:
SHAMOTO EIJI
UEDA TAKASHI
YAMAMOTO SEIEI
UEDA TAKASHI
YAMAMOTO SEIEI
Application Number:
JP2016223470A
Publication Date:
May 24, 2018
Filing Date:
November 16, 2016
Export Citation:
Assignee:
UNIV NAGOYA
OKUMA MACHINERY WORKS LTD
OKUMA MACHINERY WORKS LTD
International Classes:
B23P23/04; B23B1/00; B23P13/00; C21D1/09
Domestic Patent References:
| JP2007313515A | 2007-12-06 | |||
| JPH0373207A | 1991-03-28 | |||
| JP2008221427A | 2008-09-25 | |||
| JPS5993247A | 1984-05-29 |
Attorney, Agent or Firm:
Yoshiki Ishida
Kiyotaka Sonoda
Kiyotaka Sonoda
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