Title:
セラミックハニカム構造体成形用金型の加工装置および加工方法
Document Type and Number:
Japanese Patent JP5263655
Kind Code:
B2
Inventors:
Satoshi Ogata
Application Number:
JP2008087515A
Publication Date:
August 14, 2013
Filing Date:
March 28, 2008
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
B24B55/02; B24B1/00; B24B19/02; B28B3/26
Domestic Patent References:
| JP2005254345A | ||||
| JP2002273626A | ||||
| JP9057538A | ||||
| JP11058407A | ||||
| JP9094813A |