Title:
処理装置
Document Type and Number:
Japanese Patent JP5708506
Kind Code:
B2
Abstract:
Provided is a processing apparatus for performing a processing of a substrate to be processed using a high-pressure fluid to prevent the generation of particles and ensure airtightness in the processing container. A sealing member is installed to surround a carrying port of the processing chamber, the carrying port is closed by the cover, and the cover is restricted from retreating by the pressure in the processing chamber by a lock plate, thereby processing the wafer in the processing chamber using the high-pressure fluid. Since the sealing member is pressurized by the internal atmosphere of the processing chamber to be pressed toward the cover during the drying process, a gap between the cover and the processing chamber may be airtightly closed. Since the sealing member does not slide with respect to the processing chamber or the cover, the generation of particles is suppressed.
Inventors:
Hiroro Inatomi
Satoshi Okamura
Mikio Nakajima
Satoshi Okamura
Mikio Nakajima
Application Number:
JP2012007237A
Publication Date:
April 30, 2015
Filing Date:
January 17, 2012
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/304
Domestic Patent References:
| JP2000340540A | ||||
| JP2003056703A | ||||
| JP2006090463A | ||||
| JP2001304419A | ||||
| JP2012519392A | ||||
| JP2003051474A | ||||
| JP2013030502A | ||||
| JP2013033815A |
Foreign References:
| WO2010032722A1 |
Attorney, Agent or Firm:
Toshio Inoue
Nobuaki Takizawa
Nobuaki Takizawa