Title:
加工装置
Document Type and Number:
Japanese Patent JP6672682
Kind Code:
B2
Abstract:
A machining device includes: a spindle unit including a spindle that rotates a workpiece; and a device base having the spindle unit mounted thereon. The spindle unit includes upper and lower rolls that rotate the workpiece by contacting the workpiece, upper and lower rotary shafts that rotate integrally with the upper and lower rolls and serves as the spindle, and a support member that supports the workpiece. The device base has mounted thereon the spindle unit, a motor that rotates the upper and lower rotary shafts, and a grindstone to be brought into contact with the workpiece. The spindle unit is detachably mounted on the device base.
Inventors:
Kenichiro Kitamura
Shinsaku Kosai
Bunichi Hirakawa
Naoya Okubo
Shinsaku Kosai
Bunichi Hirakawa
Naoya Okubo
Application Number:
JP2015197393A
Publication Date:
March 25, 2020
Filing Date:
October 05, 2015
Export Citation:
Assignee:
JTEKT Corporation
International Classes:
B24B5/307; B24B5/18; B24B5/22; B24B41/06
Domestic Patent References:
| JP2001030166A | ||||
| JP3239404A | ||||
| JP2097502U | ||||
| JP57075902U | ||||
| JP9290353A | ||||
| JP11347864A | ||||
| JP2001300153A | ||||
| JP3093717U | ||||
| JP2011240424A |
Foreign References:
| US20040048551 |
Attorney, Agent or Firm:
Patent Business Corporation Suncrest International Patent Office