Title:
加工装置
Document Type and Number:
Japanese Patent JP6765926
Kind Code:
B2
Abstract:
Disclosed herein is a processing apparatus including a wafer testing unit for testing whether or not a wafer carried from a cassette mount unit is a wafer corresponding to a processing condition. The wafer testing unit measures characteristics of the carried wafer by a measuring section, and a determining section of a control unit compares actual measurements of the wafer characteristics measured by the measuring section with setpoints of wafer characteristics corresponding to the processing condition, to thereby determine conformability of the carried wafer. When it is determined by the determining section that the carried wafer is a wafer corresponding to the processing condition, the wafer is carried to a processing unit and processed. When it is determined by the determining section that the carried wafer is not a wafer corresponding to the processing condition, an error is notified by a notifying section.
Inventors:
Kazuma Sekiya
Application Number:
JP2016198614A
Publication Date:
October 07, 2020
Filing Date:
October 07, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B24B49/02; B24B51/00; H01L21/677
Domestic Patent References:
| JP2011096843A | ||||
| JP2005150324A | ||||
| JP6037170A | ||||
| JP2002050597A | ||||
| JP2015038944A | ||||
| JP2008277478A | ||||
| JP2002177861A | ||||
| JP2003243474A | ||||
| JP2016027671A | ||||
| JP2015170689A |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki