Title:
加工装置
Document Type and Number:
Japanese Patent JP7034650
Kind Code:
B2
Abstract:
To provide a processing device capable of removing a pollutant from a holding area of holding means where processing has been applied to a workpiece.SOLUTION: Holding means 14 of a processing device comprises at least a holding area 18 for sucking and holding a workpiece, a frame body 19 for supporting the holding area 18, a suction source 30 connected to the frame body 19 via a valve 32, and a water supply source 40 connected to the frame body 19 via a valve 42. Cleaning means 50 for cleaning the holding area 18 is disposed adjacent the holding means 14, and the cleaning means 50 comprises a brush part 53 and a suction part 56. The cleaning means 50 is configured to suck and remove a waste liquid B after cleaning containing a pollutant with the suction part 56 by making the pollutant collected in the holding area 18 float with the brush part 53 while supplying water W to the holding area 18 of the holding means 14 by opening the valve of the water supply source 30.SELECTED DRAWING: Figure 3
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Inventors:
Kazuma Sekiya
Application Number:
JP2017188336A
Publication Date:
March 14, 2022
Filing Date:
September 28, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B55/06; B24B27/06; B24B41/06
Domestic Patent References:
| JP2015054359A | ||||
| JP2002144228A | ||||
| JP2001277095A | ||||
| JP2018527753A |
Foreign References:
| WO2017073845A1 | ||||
| KR1020130053528A |
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko