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Title:
SiC系物質の処理方法
Document Type and Number:
Japanese Patent JP4852749
Kind Code:
B2
Abstract:

To provide a method for performing melting treatment for an SiC based substance and recovering treatment for gold or platinum group elements comprised in the SiC based substance utilizing a dry process of recovering metal copper from copper oxide.

Regarding the method for treating an SiC based substance, in a dry process where a copper-containing substance including copper oxide is melted together with a flux component and a reducing agent, so as to be molten slag, and metal copper produced by reduction reaction in the molten slag is separated/recovered utilizing a specific gravity difference with the slag, the SiC based substance is charged inside the molten slag in a state of at least being mixed with the flux component, and the SiC component is consumed as the reducing agent. It is effective that the amount of the SiC based substance to be charged is controlled to the total content of the copper oxide present in the molten slag and the copper oxide to be charged in such a manner that the mass ratio of SiC/Cu2O reaches 0.01 to 0.2.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Masahiko Ogino
Akemi Matsuyama
Application Number:
JP2006044661A
Publication Date:
January 11, 2012
Filing Date:
February 22, 2006
Export Citation:
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Assignee:
DOWA Metals & Mind Co., Ltd.
Nippon PGM Co., Ltd.
International Classes:
C22B15/00; C22B7/00; C22B11/02
Domestic Patent References:
JP2005113253A
JP55076028A
Attorney, Agent or Firm:
Komatsu Taka
Kenji Wada



 
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