Title:
加工方法及び加工装置
Document Type and Number:
Japanese Patent JP6515311
Kind Code:
B2
Abstract:
[Problem] To provide a processing method and a processing apparatus capable of realizing high-efficiency, high-precision processing with a simple configuration, using dry polishing for processing diamonds, etc. [Solution] A processing apparatus 1 has a sapphire surface plate 2, and a specimen holder 4 for holding a single-crystal diamond 3. The processing apparatus 1 also has an ozone supply unit 5 for supplying ozone gas to the contact site of the sapphire surface plate 2 and the single-crystal diamond 3.
Inventors:
Kubota Akira
Application Number:
JP2018057261A
Publication Date:
May 22, 2019
Filing Date:
March 23, 2018
Export Citation:
Assignee:
Kumamoto University
Shinryo Corporation
Shinryo Corporation
International Classes:
H01L21/304; B24B1/00
Domestic Patent References:
| JP2008060453A |
Foreign References:
| WO2014034921A1 |
Attorney, Agent or Firm:
Shuichiro Ariyoshi
Morita Yasuyuki
Tsutsui Nobuyoshi
Satoko Endo
Keita Kajiwara
Morita Yasuyuki
Tsutsui Nobuyoshi
Satoko Endo
Keita Kajiwara