Title:
加工方法及び加工装置
Document Type and Number:
Japanese Patent JP7204105
Kind Code:
B2
Abstract:
To provide a processing method and a processing device that can realize processing of high efficiency and high accuracy in dry polishing for processing GaN or Sic or the like.SOLUTION: A processing device 1 includes: a processing table 2; a synthetic quartz surface plate 3; and a sample holder 4 for holding a GaN substrate 5 that is a workpiece. In addition, the processing device 1 includes an ozone supply part 6 for supplying an ozone gas containing water and an alkaline solution to a contact site of the synthetic quartz surface plate 3 and the GaN substrate 5. Further, the processing device 1 includes an ultraviolet light radiation part 7 for irradiating a surface to be processed of the GaN substrate 5 with ultraviolet light (UV).SELECTED DRAWING: Figure 1
Inventors:
Akira Kubota
Akio Tsuboi
Akio Tsuboi
Application Number:
JP2019023699A
Publication Date:
January 16, 2023
Filing Date:
February 13, 2019
Export Citation:
Assignee:
Kumamoto University, a national university corporation
Shinryo Corporation
Shinryo Corporation
International Classes:
B24B1/00; C30B29/38; H01L21/304
Domestic Patent References:
| JP2018125549A | ||||
| JP2012064972A | ||||
| JP2011200944A | ||||
| JP2016127130A |
Foreign References:
| WO2014034921A1 |
Attorney, Agent or Firm:
Shuichiro Ariyoshi
Yasuyuki Morita
Nobuyoshi Tsutsui
Satoko Endo
Keita Kajiwara
Yasuyuki Morita
Nobuyoshi Tsutsui
Satoko Endo
Keita Kajiwara
Previous Patent: Camera cover and opening/closing operation tool
Next Patent: Navigation system for ultrasonic probe and its navigation display device
Next Patent: Navigation system for ultrasonic probe and its navigation display device