Title:
樹脂パッケージ基板の加工方法
Document Type and Number:
Japanese Patent JP7114176
Kind Code:
B2
Abstract:
To process a resin package substrate having warp and uneven surface after flattening the front surface side of the resin package substrate.SOLUTION: A processing method of a resin package substrate includes: a step for pasting an adhesive tape on a front surface of the resin package substrate by pasting an adhesive region onto an end material region, while bringing a non-adhesive region of the adhesive tape into contact with the front surface side of a device region so as to follow the unevenness of an electrode pattern; a step for stimulating a curable liquid resin to cure after sticking an adhesive tape side of the rein package substrate a warp of which has tentatively been corrected, into a curable liquid resin on a top surface of a carrier sheet which is supplied with the curable liquid resin on its top surface, and fixing the resin package substrate and the carrier sheet via the adhesive tape with the curable liquid resin; and a step for sucking and holding the carrier sheet side of the resin package substrate by a chuck table, and grinding a mold resin layer of the resin package substrate by a grind stone.SELECTED DRAWING: Figure 5
Inventors:
Manpei Tanaka
Application Number:
JP2018106184A
Publication Date:
August 08, 2022
Filing Date:
June 01, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B24B7/30; B24B41/06
Domestic Patent References:
| JP2016159412A | ||||
| JP2016132056A | ||||
| JP2012151156A | ||||
| JP2017079291A | ||||
| JP2015085414A |
Foreign References:
| WO2013021644A1 | ||||
| US20170062278 |
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Tomohiro Okamoto
Takahiro Kasahara