Title:
半導体構造の加工方法
Document Type and Number:
Japanese Patent JP5004885
Kind Code:
B2
Inventors:
Chiju Kyouya
Yasushi Kotani
Michihiro Sano
Yasushi Kotani
Michihiro Sano
Application Number:
JP2008183876A
Publication Date:
August 22, 2012
Filing Date:
July 15, 2008
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L21/306
Domestic Patent References:
| JP10126001A | ||||
| JP2004284942A | ||||
| JP2008141113A | ||||
| JP6148660A | ||||
| JP2009004787A | ||||
| JP2003243703A | ||||
| JP2004247411A | ||||
| JP2000232090A | ||||
| JP2006080172A | ||||
| JP10229212A | ||||
| JP2009117744A | ||||
| JP2008260003A | ||||
| JP2009029688A |
Attorney, Agent or Firm:
Keishiro Takahashi
Mikio Kuruyama
Mikio Kuruyama