PROCESSING METHOD OF SUBSTRATE, PROCESSED SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, ELECTRONIC APPARATUS AND MOVABLE BODY

Title:

PROCESSING METHOD OF SUBSTRATE, PROCESSED SUBSTRATE, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT, ELECTRONIC APPARATUS AND MOVABLE BODY

Document Type and Number:

Japanese Patent JP2016046659

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a processing method of a substrate effectively preventing an unnecessary deposit from remaining on the substrate subsequent to dry etching while stably fixing the substrate at the time of dry etching, and further to provide a processed substrate having a desired pattern and an unintended deposit not remaining.SOLUTION: A processing method of a substrate includes: a bonding step 1a of bringing a substrate 1 and a support member 3 into contact with each other and bonding them together in a state of applying surface activation treatment to at least one of the substrate 1 made of an inorganic material coated with a mask 4 with a predetermined pattern and the support member 3; a dry etching step 1b of applying dry etching to the substrate 1 in a state of being bonded to the support member 3; and a separating step 1c of separating the substrate 1 applied with the dry etching from the support member 3 by dissolving at least a part of the support member 3 by using a dissolving solution selectively dissolving the support member 3.SELECTED DRAWING: Figure 1

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