Title:
PROCESSING METHOD OF SUBSTRATE, SEMICONDUCTOR DEVICE AND COMPOSITION FOR TEMPORARILY FIXING
Document Type and Number:
Japanese Patent JP2013098305
Kind Code:
A
Abstract:
To provide a processing method of a substrate allowing reduction or removal of temporarily fixing material residue after peeling a substrate from a support even without using an organic solvent which may damage an interlayer insulator and the like.
A processing method of a substrate has the steps of: (1) obtaining a laminate by temporarily fixing a substrate onto a support through a temporarily fixing material containing a polymer (A) having at least one kind of repeating units selected form a repeating unit comprising an acetal structure and a repeating unit comprising a peroxide structure; (2) processing the substrate and/or transferring the laminate; and (3) peeling the substrate from the support.
Inventors:
YASUDA YOSHITOMO
Application Number:
JP2011238888A
Publication Date:
May 20, 2013
Filing Date:
October 31, 2011
Export Citation:
Assignee:
JSR CORP
International Classes:
H01L21/02; C08G67/00; C09J5/00; C09J11/02; C09J159/00; C09J173/00
Domestic Patent References:
| JP2005023205A | 2005-01-27 | |||
| JP2010261000A | 2010-11-18 | |||
| JP2012211254A | 2012-11-01 |
Foreign References:
| WO2009142078A1 | 2009-11-26 | |||
| WO2004087791A1 | 2004-10-14 |
Attorney, Agent or Firm:
Patent corporation ssinpat