透明板の加工方法

Japanese Patent JP7306859

B2

Provided are a support sheet a method for processing a transparent plate. The support sheet for supporting a workpiece at least comprises a transparent sheet with a front surface for supporting the workpiece and a reflection film stacked on the rear surface of the transparent sheet. The method for processing the transparent plate at least comprises: a groove forming step of positioning a cutting blade on the front surface of the transparent plate (workpiece) and cutting transparent plate to form a plurality of half-cut grooves not reaching the rear surface; a supporting step of positioning the front surface of the support sheet on the front surface of the transparent plate to support the transparent plate; and a cutting step of positioning the cutting blade on the rear surface of the transparent plate to cut a region corresponding to the half-cut groove formed on the front surface. The cutting step includes a detection step of detecting the half-cut groove formed on the front surface from the rear surface of the transparent plate to diffusely reflect light on the side and bottom surfaces of the half-cut groove formed on the front surface by the reflection film and clearly detect the half-cut groove formed on the front surface from the rear surface side.

JPH07292350	GRAIN COATED WITH POLYOLEFIN RESIN FOR CUTTING OR POLISHING, METHOD FOR CUTTING OR POLISHING USING THE SAME ABRASIVE GRAIN AND CUTTING OR POLISHING LIQUID USING THE SAME ABRASIVE GRAIN
JPS61284406	CUTTER
WO/2008/035529	CUTTING METHOD

Itsuto Kiuchi

JP2019073928A

July 11, 2023

April 09, 2019

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Disco Co., Ltd.

B24B27/06; B24B41/06; B24B49/12; H01L21/301

JP2014203832A
JP2011159679A
JP6037181A
JP2004142428A
JP6232255A
JP2019004053A

US20040166654

Atago Patent Attorneys Office
Naozumi Ono
Sachiko Okunuki
Tsuyoshi Tsukano
Yoshifumi Kaneko

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