Title:
PROCESSING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JP2022090797
Kind Code:
A
Abstract:
To provide a processing method for a wafer capable of easily removing a reinforcement part remaining in an outer peripheral part of the wafer.SOLUTION: The present invention relates to a processing method for a wafer for processing the wafer comprising: a device area in which devices are formed respectively in a plurality of regions defined by a plurality of predetermined dividing lines arrayed in a grid shape so as to cross each other, on a front side; a recess formed, on a rear side, in an area corresponding to the device area; and an annular reinforcement part enclosing the device area and the recess in an outer peripheral part. The processing method includes: a cutting step of dividing the device area into a plurality of device chips and forming a cutting groove in the reinforcement part; a dividing step of dividing the reinforcement part with the cutting groove defined as a starting point; and removing step of injecting a fluid toward the reinforcement part from a predetermined injection position which is located outside of the wafer, thereby scattering, toward an opposite side of the injection position, and removing the divided reinforcement parts.SELECTED DRAWING: Figure 9
Inventors:
OKAMURA TAKU
Application Number:
JP2020203327A
Publication Date:
June 20, 2022
Filing Date:
December 08, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B27/06; B24B41/06; H01L21/304
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
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