Title:
PROCESSING METHOD OF WAFER
Document Type and Number:
Japanese Patent JP2023104445
Kind Code:
A
Abstract:
To prevent a DAF and a protective member from adhering in a mark (a groove) for replacing a notch or the like.SOLUTION: A processing method of a wafer, for reducing a thickness into a finishing thickness by grinding the wafer in which a structure indicating a crystal orientation is formed at an outer periphery while having a bevelled part from a front surface to a back surface at the outer periphery, from the back surface side, includes steps of: removing the bevelled part at a depth of the finishing thickness or more from the front surface of the wafer by cutting the wafer along the outer periphery; making a cutting blade cut into a position adjacent to the structure, and cutting the wafer at the depth that is the finishing thickness ir more and less than the thickness of the wafer, from the front surface; forming a groove indicating a crystal direction of the wafer instead of the structure; distributing a protective member to the front surface of the wafer; and grinding the wafer from the back surface to reduce the thickness to the finishing thickness and removing a bottom part of the groove to expose the groove to the back surface of the wafer.SELECTED DRAWING: Figure 6
Inventors:
HIROZAWA SHUNICHIRO
Application Number:
JP2022005433A
Publication Date:
July 28, 2023
Filing Date:
January 18, 2022
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B24B7/22; B24B9/00; B24B19/02
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato