Title:
被加工物の加工方法
Document Type and Number:
Japanese Patent JP7104558
Kind Code:
B2
Abstract:
To prevent a chip from being damaged by avoiding a tape transfer work and to raise the productivity by increasing the workability in dividing a workpiece having a film on a backside of a substrate.SOLUTION: A method for processing a workpiece W having a film W2 formed on a backside W1b of a substrate W1 and a device D formed in each region partitioned by division-scheduled lines S in a surface W1a comprises: a step of sticking a tape T to a workpiece backside W2b; an etching step of performing a plasma etching process from the side of the workpiece surface W1a to form grooves M in the substrate W1 along division-scheduled lines S after sticking the tape T; a step of putting the tape T side of the workpiece W on a placing plane 50a, after the etching step; a step of applying a press-pressure to the device D by emitting a jet of a high-pressure fluid toward the workpiece surface W1a after the workpiece-putting step; and a step of picking up the device D from the tape T to form a device chip C1 having the film W2 on the backside W1b after the press-pressure applying step.SELECTED DRAWING: Figure 10
Inventors:
Park Mitama
Application Number:
JP2018098598A
Publication Date:
July 21, 2022
Filing Date:
May 23, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; H01L21/3065; H01L21/683
Domestic Patent References:
| JP2017103330A | ||||
| JP2015532532A | ||||
| JP7221051A |
Foreign References:
| US20140051232 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office