Title:
PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2021194715
Kind Code:
A
Abstract:
To process a wafer without bringing up and conveying an annular region.SOLUTION: A processing method which processes a disk-like wafer having, on a rear surface side, a circular region and an annular region surrounding the circular region and thicker than the circular region, comprises: a wafer unit forming step of bonding the circular region and the annular region to an adhesive tape bonded to an annular frame; a first holding step of making a first holding table having a holding surface which is smaller in diameter than the circular region hold the circular region of the wafer through the adhesive tape; a separating step of separating the annular region by cutting the wafer along an outer periphery part of the circular region of the wafer held by the first holding table; a bringing-down step of making a second holding table having a holding surface which is larger in diameter than the wafer bring down the circular region, after the separating step; and a cutting step of making a second cutting blade cut a part or the whole of the annular region after the bringing-down step.SELECTED DRAWING: Figure 4
Inventors:
TAKITA TOMOHARU
HARADA SHIGENORI
SUGIYAMA TOMOAKI
KOMATSU ATSUSHI
HARADA SHIGENORI
SUGIYAMA TOMOAKI
KOMATSU ATSUSHI
Application Number:
JP2020100755A
Publication Date:
December 27, 2021
Filing Date:
June 10, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B27/06; B24B41/06; H01L21/301
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano
Tomohiro Okamoto
Kasahara Takahiro
Ei Okamoto
Takayuki Okano