PROCESSING OF SUPPORT PLATE FOR SEMICONDUCTOR DEVICE

Title:

PROCESSING OF SUPPORT PLATE FOR SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPH04125968

Kind Code:

A

Abstract:

PURPOSE: To facilitate processing of a support plate by a method wherein a screen printing is performed on the support plate with acid-resistant printing ink to draw a prescribed pattern and the support plate is subjected to etching work with a specified etching liquid.

CONSTITUTION: A screen printing is performed on the surface of a molybdenum plate 4 with acid-resistant printing ink to draw a prescribed pattern. Then, a tungsten plate 7 is adhered on the rear of the plate 4 using an acid-resistant wax 6. Grooves are processed in the plate 4 with an etching liquid of a compositional ratio of 88 to 92% of a nitric acid, 3.5 to 6% of a hydrofluoric acid and 3.5 to 6% of an acetic acid conforming to the pattern. Thereby, a peeling of the ink is eliminated, an etching work is facilitated and the working accuracy of the support plate is improved.

Inventors:

AIMOTO SHINGO

Application Number:

JP24819390A

Publication Date:

April 27, 1992

Filing Date:

September 18, 1990

Export Citation:

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Assignee:

MEIDENSHA ELECTRIC MFG CO LTD

International Classes:

H01L29/74; H01L21/28; H01L21/306; H01L21/66; H01L21/768; H01L23/522; (IPC1-7): H01L21/28; H01L21/306; H01L21/66; H01L21/90; H01L29/74

Attorney, Agent or Firm:

Fujiya Shiga (1 person outside)

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