Title:
PROCESSING SYSTEM, PAD CONVEYOR, LIQUID RECEIVING DEVICE, AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2023167965
Kind Code:
A
Abstract:
To provide an improved device capable of shortening a time for stopping polishing operation of a polishing device for exchanging polishing pads and of improving productivity of the polishing device.SOLUTION: A processing system includes: a polishing device 500 for polishing a workpiece; a pad leveling device 600 for performing leveling processing of a polishing pad; and a pad conveyor 700 conveying a pad structure 6 including at least the polishing pad from the pad leveling device 600 to the polishing device 500. The pad conveyor 700 has a liquid receiving tray for receiving liquid dropping from the pad structure 6.SELECTED DRAWING: Figure 1
Inventors:
MIYAGAWA TOSHIKI
SAITO KENICHIRO
FUKUSHIMA MAKOTO
SAITO KENICHIRO
FUKUSHIMA MAKOTO
Application Number:
JP2022079536A
Publication Date:
November 24, 2023
Filing Date:
May 13, 2022
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B45/00; B24B37/00; B24B37/12; B24B53/017; H01L21/304
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
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