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Title:
加工システム及び加工方法
Document Type and Number:
Japanese Patent JP7119603
Kind Code:
B2
Abstract:
To provide a processing system and a processing method capable of performing highly accurate processing by removing affection of thermal displacement.SOLUTION: A processing system S is configured so that a transport device 100 delivers surely, a workpiece W which is positioned and supported on a positioning pin 104 of a transfer bar 101, to a jig 51 set to an origin position (x0, y0) for workpiece delivery, then positions the workpiece on a positioning pin 51p. A boring processing device 1 detects positional deviation by a touch sensor 60 in a state in which the jig 51 positions and supports the workpiece W to the positioning pin 51p, then, moves the jig 51 to a Y-axis direction by a correction 84 for correcting the positional deviation, then in the state, performs processing action by a spindle head 30.SELECTED DRAWING: Figure 6

Inventors:
Kazuhiko Yoshida
Yoshishita Takeshita
Katsumi Sugiura
Application Number:
JP2018109483A
Publication Date:
August 17, 2022
Filing Date:
June 07, 2018
Export Citation:
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Assignee:
JTEKT Corporation
International Classes:
B23Q15/18; B23B35/00; B23B39/08; B23B41/12; B23B41/16; B23B47/00; B23B49/00; B23Q7/00; B23Q11/12; B23Q17/20; B23Q17/22; G05B19/404
Domestic Patent References:
JP57018914U
JP2292110A
JP5038643A
JP6031938U
JP7019693A
JP10230404A
JP2007190653A
JP2009039786A
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office
Kiichi Yamamoto
Kobayashi
Gunji Kimura