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Title:
PROCESSING SYSTEM
Document Type and Number:
Japanese Patent JP3485493
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a processing system for reducing costs for forming a system environment.
SOLUTION: In this processing system, down-flow clean air is supplied from the upper part through a temperature/moisture adjuster 81 for controlling temperature and moisture to a first block B in which processing for applying a reflection preventing film on a wafer W is operated, and a second block B2 in which processing for applying a resist film on the wafer W is operated, and downflow clean air is supplied from the upper part through a temperature adjuster 83 for controlling only the temperature to a third block B3 in which processing for developing the exposed resist film is operated, and the downflow clean air is directly supplied to a first block B2 in which processing for carrying the wafer W between the blocks is excited.


Inventors:
Kazunari Ueda
Application Number:
JP13673399A
Publication Date:
January 13, 2004
Filing Date:
May 18, 1999
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; G03F7/16; G03F7/30; H01L21/00; (IPC1-7): H01L21/027; G03F7/16; G03F7/30
Domestic Patent References:
JP10261689A
JP9205062A
JP10214761A
JP10144763A
JP10335219A
JP10305256A
JP10294352A
JP10335146A
JP11251399A
Attorney, Agent or Firm:
Junichi Ohmori