PRODUCING METHOD FOR SEMICONDUCTOR DEVICE - Oki Electric Industry Co., Ltd.

Title:

PRODUCING METHOD FOR SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP3485513

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To reduce production costs and to keep performance and reliability even when the bore of a wafer is enlarged.
SOLUTION: When producing a semiconductor device 40 by applying resin sealed packaging to a wafer 35 having a main surface formed with multiple bumps 34 respectively connected to multiple electrode pads after a wafer process is completed, the producing method is provided with a process for installing and heating a sheet sealing member 36 containing thermosetting resins on the wafer so as to cover the main surface of the wafer, a process for exposing the tops of the bumps by polishing the sheet sealing member after the sheet sealing member is cured, a process for forming a conductive external terminal 38 while connecting it to the bump, and a process for cutting the wafer completely formed with the external terminal and making it into chips. Such heating is performed at the curing temperature of the sheet sealing member.

Inventors:

Yasuo Tanaka

Application Number:

JP2000010676A

Publication Date:

January 13, 2004

Filing Date:

January 19, 2000

Export Citation:

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