PRODUCTION APPARATUS OF LAMINATED ELECTRONIC PART

Japanese Patent JP3805273

B2

PROBLEM TO BE SOLVED: To provide a production apparatus of a laminated electronic part capable of being produced at a higher production speed, wherein the laminated electronic part can meet the production of products at low temperatures in a dry state.
SOLUTION: A base board 20 is installed in a straight specific section path so as to reciprocate and vertically move, and also an insulated layer forming means C for discharging an insulating resin paste, a conductive layer forming means E for injecting a conductive paste by an ink-jet system, and a drying means L for drying the paste are provided in parallel on the section path, in the number of one or a plurality, for each means. While the base board 20 reciprocates the section path one or several times, a thin film layer arranged with a predetermined conductive pattern is formed on the insulated layer, and the steps are repeated to form a laminated electronic part.

Kakimoto
Futatsuaki Matsumoto
Yasuda Hisashi
Makoto Furuta

JP2002095854A

August 02, 2006

March 29, 2002

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uht corporation

H01F41/00; H01G13/00; H01L21/00; H05K3/46; H05K3/12; (IPC1-7): H01F41/00; H01G13/00

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Sadayuki Hosoi
Mitsuo Chonan
Ishiwatari Eibo

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