Title:
PRODUCTION OF BASE BOARD FOR MULTICHIP MODULE
Document Type and Number:
Japanese Patent JP3815033
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a production method for a base board for MCM in which a semiconductor bare chip, or the like is embedded.
SOLUTION: A base board is produced by a two stage machining method which combines etching and pressing. A resist mask 12 is formed on a board 11 and subjected to chemical etching o form protruding connection posts 13. The board provided with the connection posts is then inserted between dies 14, 14' and pressed by gradually applying a load 16 to form a recessed marker 17 tapered at 45°C.
Inventors:
Koji Yamada
Kenji Sekine
Mountain Saki Matsuo
Osamu Kagaya
Kiichi Yamashita
Kenji Sekine
Mountain Saki Matsuo
Osamu Kagaya
Kiichi Yamashita
Application Number:
JP6972798A
Publication Date:
August 30, 2006
Filing Date:
March 19, 1998
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B21D22/04; H01L23/12; H01L23/52; H01L25/04; H01L25/18; (IPC1-7): H01L23/52; B21D22/04; H01L23/12
Domestic Patent References:
| JP7326708A | ||||
| JP7111298A | ||||
| JP4049640A |
Attorney, Agent or Firm:
Manabu Inoue