Title:
PRODUCTION OF BASE MATERIAL FOR ELECTRONIC PARTS AND RESIST REMOVING AGENT USED FOR THE METHOD
Document Type and Number:
Japanese Patent JP3401201
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a process for production for obtaining a base material for electronic parts having excellent performance by using a resist removing agent which is highly safe and satisfies the performance required for removing the unnecessary resist film adhered to peripheral parts, marginal peripheral parts and rear surface part of the substrate.
SOLUTION: The base material for electronic parts is produced by applying a coating liquid for forming a radiation sensitive resist film on a substrate surface and drying the film, then dissolving and removing the unnecessary resist film adhered to at least the peripheral parts, the marginal peripheral parts and rear surface part of the substrate by using the resist removing agent. At this time, an organic solvent which has the surface tension at 20°C within a range larger than 35 dyne/cm and smaller than 60 dyne/cm and exhibits the solubility to the radiation sensitive resist film is used as the resist removing agent.
Inventors:
Atsushi Koshiyama
Futoshi Shimai
Takehito Fukushima
Futoshi Shimai
Takehito Fukushima
Application Number:
JP34328898A
Publication Date:
April 28, 2003
Filing Date:
December 02, 1998
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
H01L21/027; C11D7/50; C11D11/00; G03F7/16; G03F7/42; H01L21/02; H01L21/304; G03F7/20; G03F7/32; (IPC1-7): G03F7/42; H01L21/027; H01L21/304
Domestic Patent References:
| JP9269601A | ||||
| JP667439A | ||||
| JP5343383A | ||||
| JP684779A | ||||
| JP9164364A |
Attorney, Agent or Firm:
Agata Akira (1 person outside)
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