PURPOSE: To prevent the decrease in the film thickness of the pattern in the peripheral part of a chip from the film thickness in the parts except the peripheral part of the chip by preliminarily forming the bank of a negative type dyeable photosensitive resin film to the peripheral part of the chip.

CONSTITUTION: The negative type dyeable photosensitive resin film 11 is coated on a wafer segmented to plural pieces of the chips 10, then a photomask 13 formed to irradiate only the peripheral part 12 of the chip is brought into tight contact with or proximity to the resin film 11 and light 14 is projected thereto to expose the resin film 11. The bank 15 of the negative dyeable resin is preliminarily formed only to the peripheral part 12 of the chip by dissolving the uncured parts by development. The bank 15 of the negative type dyeable photosensitive resin is not removed as said resin is not dissolved in the liquid developer. Said bank remains in the peripheral part 12 of the chip to the last. The decrease of the film thickness of the pattern in the peripheral part of the chip from the film thickness in the parts except the peripheral part of the chip is thereby prevented.