PURPOSE: To produce a copper lining film improved in adhesiveness by applying dry copper plating on a film made of polyether ketone, polyether sulfone or the like and after that, heat treating under a prescribed atmosphere, temp. and time.
CONSTITUTION: The copper plating is applied by decomposing copper formate in an evacuating atmosphere or non-oxidizing atmosphere at ≤165°C on the film made of an aromatic polyketone or an aromatic polysulfone selected from the group consisting of polyether ketones polyether ether ketones, polyether sulfones, polysulfones and polybiphenylsulfones. Palladium of 100-4000ppmweight% is preferably incorporated in the copper formate. Next, the copper lining film is heat treated in an oxidizing atmosphere under a condition fixed in temp. T (°C) and time H (min) to 150≤T≤280, 5≤H, 720-3T≤H≤1420-5T. As a result, the copper lining film having copper film drastically improved in adhesiveness and high in reliability is obtained.
ANDO KAZUHIRO
KUDO HIROAKI
KAWAKAMI TAKAMASA
