Title:
PRODUCTION OF COPPER-SILVER COMPOSITE POWDER FOR ELECTRICALLY CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JPH11310806
Kind Code:
A
Abstract:
To provide a method for producing copper-silver composite powder for electrically conductive paste exhibiting electrical conductivity close to that of silver.
Copper powder is mixed with, by weight, 3 to 50% silver oxide, the copper powder is mechanically bonded to the silver oxide while pulverizing is executed, and, thereafter, reducing treatment is executed at 120 to 400°C to obtain powder of ≤100 μm particle size and ≥2000 cm2/g specific surface area value in a BET method. In the process of the pulverizing, ≤1% fatty acid is added, or before the reducing treatment, 0.1 to 2% fatty acid is added to mix, and the reducing treatment is executed at 150 to 500°C.
Inventors:
KAJITA OSAMU
NISHIDA MOTONORI
YOSHITAKE MASAYOSHI
NISHIDA MOTONORI
YOSHITAKE MASAYOSHI
Application Number:
JP11839098A
Publication Date:
November 09, 1999
Filing Date:
April 28, 1998
Export Citation:
Assignee:
FUKUDA METAL FOIL POWDER
International Classes:
B23K35/22; B22F1/02; B22F9/02; B22F9/22; C22C9/00; H01B1/00; H01B1/22; H05K1/09; H05K9/00; (IPC1-7): B22F9/02; B22F1/02; B22F9/22; B23K35/22; C22C9/00; H01B1/00; H01B1/22; H05K1/09; H05K9/00
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