PURPOSE: To produce a copper-solder inlay clad material which is easy to manufacture and is joined excellently with both metallic materials to the exact size and shape by using a round wire as a solder material and rolling said material on a flat copper base material in press contact therewith.
CONSTITUTION: A belt-like base material 1 consisting of copper or a copper alloy fed from a delivery device 4 is defatted and cleaned by trichloroethylene, etc. and is descaled by a wire brush, etc. in a treatreating devcie 5. A solder material 2 fed from a delivery device 6 is pretreated with a similar pretreating device 7. The pretreated material 1 and material 2 are fed to rolling rolls 8, 9 in the state of attaching longitudinally the material 2 on the one surface of the material 1 and are cold rolled by said rolls in press contact with each other, thereby forming an inlay clad material 3. The material 1 is subjected to 9W50% reduction in the stage of rolling to bring both materials in press contact with each other.
OOTAKE HIROO
YOSHIDA ZENICHI
YAMAGUCHI KENJI
ABE MASAHIKO
| JPS57100887A | 1982-06-23 | |||
| JPS54155158A | 1979-12-06 | |||
| JPS53109853A | 1978-09-26 |
Next Patent: AUTOMATIC SOLDERING DEVICE