PURPOSE: To prevent the activation of impurities by irradiating a crystalline silicon coating film with ions containing impurities for imparting N- or P-type conductivity thereby adding N- or P-type impurities, at a specified concentration, to the silicon coating film.
CONSTITUTION: Underlying silicon oxide film 102, amorphous silicon and nickel oxide are deposited sequentially on a glass substrate 101. It is then annealed to crystallize the silicon film 103. Nickel functions as a catalytic element for accelerating crystallization of amorphous silicon and the concentration thereof is set in the range of 1×1015-1×1019 atom/cm3. Since the estimated density of defect in the crystalline silicon is on the order of 1×1018 atom/cm3, impurities having concentration lower than 1×1018 atom/cm3 are absorbed mainly at the grain boundary and not activated substantially.
KUSUMOTO NAOTO
ONUMA HIDETO
TAKEMURA YASUHIKO
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