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Patent Searching and Data


Title:
PRODUCTION OF CU-W SINTERED COMPACT
Document Type and Number:
Japanese Patent JPH05271702
Kind Code:
A
Abstract:

PURPOSE: To obtain a density approximating to the ideal density at the time of obtaining a Cu-W sintered compact by the mixing method by which the components are precisely mixed in a specified ratio.

CONSTITUTION: A mixture of Cu powder and W powder in a specified ratio placed in a compacting capsule, or the intermediate sintered compact formed by compacting the mixture and then sintering the green compact at 1000-1400°C and having 1-50% porosity is subjected to hot isostactic pressing(HIP) in an inert atmosphere at ≥1000°C and ≥100atm. A uniform sintered compact having the density approximating the ideal density is obtained in this way.


Inventors:
Okabe Tadashi
Nobuyoshi Goto
Kai Yasunao
Matsumoto real man
Application Number:
JP6874092A
Publication Date:
October 19, 1993
Filing Date:
March 26, 1992
Export Citation:
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Assignee:
Nippon Tungsten Co., Ltd.
International Classes:
B22F3/14; B22F1/00; H05K1/09; (IPC1-7): B22F1/00; B22F3/14
Attorney, Agent or Firm:
Kobori Masashi