To produce an electric circuit board having required rigidity, heat resistance, solder resistance and coefficient of thermal expansion by employing an easy plating resin having a composition of the mixture of polyphenylene sulfide resin and polyester resin, an inorganic fiber and an inorganic filler subjected to palladium chloride treatment.
The circuit part 2 of a circuit board 1 is one surface exposed part of predetermined type composed of an easy plating resin material and an electric circuit is formed thereat by plating. The easy plating resin is a composition of a mixture of polyphenylene sulfide resin and polyester resin, an inorganic fiber and an inorganic filler subjected to palladium chloride treatment. The composition is excellent in mechanical properties, e.g. tensile strength and bending strength, heat resistance and adhesion to plating. More specifically, a drawback inherent to PPS resin, i.e., insufficient softness of plating, is improved by mixing an inorganic filler subjected to palladium chloride treatment and adhesion to plating is also enhanced.
SEKI TAKAHIRO
HIYOUGATANI TERUKI
RYODEN KASEI KK
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