Title:
PRODUCTION OF ELECTROLESS NICKEL PLATING FILM
Document Type and Number:
Japanese Patent JPH0565657
Kind Code:
A
Abstract:
PURPOSE: To reduce nodules (projections) on a nickel alloy plating film formed by means of electroless nickel plating and further to obtain a nickel alloy plating film practically free from the nodules with a diameter of several micrometers.
CONSTITUTION: An aluminum substrate is degreased and etched by using an aqueous solution of acids consisting of sulfuric acid and nitric acid. Subsequently, a first zincate film is formed and then this first zincate film is peeled off. After a second zincate film is formed, electroless plating is done. Further, in the stage where the above-mentioned first zincate film is peeled off, the first zincate film is peeled off by using an aqueous solution of acid containing surfactant.
Inventors:
KOMATSU TATSUMI
HAGIWARA SHINGO
ISHIDA EIICHI
HAGIWARA SHINGO
ISHIDA EIICHI
Application Number:
JP25412791A
Publication Date:
March 19, 1993
Filing Date:
September 06, 1991
Export Citation:
Assignee:
KAWASAKI KASEI CHEMICALS
International Classes:
C23C18/18; C23C18/32; C23F1/20; (IPC1-7): C23C18/18; C23C18/32; C23F1/20
Next Patent: ELECTROLESS NICKEL PLATING BATH