Title:
PRODUCTION OF ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH05259620
Kind Code:
A
Abstract:
PURPOSE: To provide a method for manufacturing a mechanically reliable electronic circuit device with excellent yield while maintaining the high alignment precision of a chip component even for the narrow pitch lead terminal of a wiring board.
CONSTITUTION: The production comprises a process of mounting a chip component 3 on a wiring board plane 1 through an adhesive layer and aligning the corresponding electrode 3a of the chip component 3 with the lead terminal 1a on the wiring board plane 1 so as to adhere and fix and a process of electrically connecting the aligned lead terminal 1a of the wiring board 1 and the corresponding electrode 3a of the chip component 3 by plating.
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Inventors:
Yoshie Yamamoto
Masayuki Saito
Masayuki Saito
Application Number:
JP5286492A
Publication Date:
October 08, 1993
Filing Date:
March 11, 1992
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H05K3/32; H05K3/24; H05K3/30; (IPC1-7): H05K3/32
Attorney, Agent or Firm:
Suyama Saichi