To bond an electronic component to a substrate with a reworkable adhesive and further readily apply the adhesive in a job site of a production process for the electronic component by using a new adhesive composition comprising a monofunctional vinyl compound and a curing initiator.
(A) A monofunctional vinyl compound in a major amount effective in providing thermoplastic properties is initially compounded with (B) a curing initiator selected from a free-radical initiator and/or a photoinitiator and further (C) a polyfunctional vinyl compound in a minor amount ineffective in diminishing the thermoplastic properties of the curing composition, (D) a filler and (E) a bonding accelerator to produce a reworkable adhesive composition. The resultant composition is then applied to an electronic component or a substrate and the electronic component is then brought into contact with the substrate to cure the composition in situ. A compound represented by the formula [M-Xm]n-Q [(m) is O or 1; (n) is 1; M is a maleimide represented by formula I (R1 is H or a 1-5C alkyl); X is represented by formula II or the like; Q is an alkyl or the like] is preferred as the component A.
MA BODAN
XIAO CHAODONG
SHENFIELD DAVID
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