Title:
PRODUCTION OF EPOXY RESIN COMPOSITION AND EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3111819
Kind Code:
B2
Abstract:
PURPOSE: To obtain an epoxy resin composition which can give a cured product markedly reduced in void formation and being excellent in moldability and is desirable as a resin for sealing semiconductor devices in an industrially advantageous manner.
CONSTITUTION: This production process is a process for producing an epoxy resin composition essentially consisting of an epoxy resin, a curing agent, desirably 73vol.% or above inorganic filler and a curing catalyst, which process comprises surface-treating at least part of the inorganic filler with at least part of the epoxy resin and/or the curing agent before curing, uniformly mixing the surface-treated inorganic filler with the remaining components and kneading the resulting mixture.
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Inventors:
Toshio Shiobara
Takayuki Aoki
Eiichi Asano
Kazutoshi Tomiyoshi
Hatsuji Shiraishi
Takayuki Aoki
Eiichi Asano
Kazutoshi Tomiyoshi
Hatsuji Shiraishi
Application Number:
JP18190594A
Publication Date:
November 27, 2000
Filing Date:
July 11, 1994
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08K9/00; C08L63/00; (IPC1-7): C08L63/00; C08K9/00
Domestic Patent References:
| JP6179736A | ||||
| JP6163754A | ||||
| JP6112368A | ||||
| JP6107911A | ||||
| JP625385A | ||||
| JP673192A |
Attorney, Agent or Firm:
Takashi Kojima
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