Title:
PRODUCTION OF EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPH05194714
Kind Code:
A
Abstract:
PURPOSE:To obtain the title material free from the occurrence of flash in molding and reduced in stress by melt compounding an epoxy resin with a specified amount of a mixed melt prepared by heat melting a phenolic resin and a specified silicone polymer. CONSTITUTION:100 pts.wt. phenolic resin (e.g. phenolic novolak resin) is mixed with at most 100 pts.wt. silicone polymer of the formula [whereinR' and R'' are each a divalent hydrocarbon group; POA is polyoxyalkylene; x is 100 to 150; and (y+z)<=10] and the mixture is melted by heating to give a mixed melt. An epoxy resin (e.g. EOCN102, a product of Nippon kayaku Co.) is mixed with the mixed melt in an amount sufficient to provide a weight ratio of the epoxy resin to the silicone polymer of 100:(4 to 30), and the mixture is melt compounded.
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Inventors:
HIROKAWA KOZO
KUBO ETSUJI
URANO TAKASHI
HAGIWARA SHINSUKE
KUBO ETSUJI
URANO TAKASHI
HAGIWARA SHINSUKE
Application Number:
JP32197492A
Publication Date:
August 03, 1993
Filing Date:
December 01, 1992
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/30; C08G59/00; C08G59/62; C08L63/00; (IPC1-7): C08G59/30; C08G59/62; C08L63/00
Attorney, Agent or Firm:
Kunihiko Wakabayashi