Title:
Production equipment which applies the nozzle structure, the applicator, and fluid material which carry out discharge of the fluid material
Document Type and Number:
Japanese Patent JP5989309
Kind Code:
B2
Abstract:
The invention concerns a nozzle arrangement (5) for dispensing liquid material, in particular for applying hot melt adhesive onto a substrate, comprising a nozzle orifice (31) for dispensing the liquid material, said orifice (31) being associated with a first (25) and/or a second component (27), and positioning elements (21) for fixing the position of the first component (25) with respect to the second component (27). The invention concerns in particular a nozzle arrangement (5) in which the positioning elements (21) are formed as centering screws (21) extending into fitting bores of the second component (27) and into corresponding recesses (39) of the first component (25). The invention further concerns an applicator (1) and a production facility for applying liquid material.
More Like This:
JP5679866 | Coating device and coating method |
JP4326620 | Variable Die Tip Tip or Variable Nozzle Modular Die |
JP2002086041 | DIE FOR EXTRUSION |
Inventors:
Fbert kuchner
Stephan Olbrich
Stephan Olbrich
Application Number:
JP2011163953A
Publication Date:
September 07, 2016
Filing Date:
July 27, 2011
Export Citation:
Assignee:
NORDSON CORPORATION
International Classes:
B05C5/02; B29C48/08
Domestic Patent References:
JP2010005508A | ||||
JP63164701A | ||||
JP2150548A | ||||
JP2008066465A |
Attorney, Agent or Firm:
Okabe
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida
Takao Ochi
Seiichiro Takahashi
Takao Matsui
Kosuke Uchida
Previous Patent: Mounting structure of an aeration integral-type joint and a joint
Next Patent: PRODUCTION OF ETHYNYL COMPOUND POLYMER
Next Patent: PRODUCTION OF ETHYNYL COMPOUND POLYMER