PURPOSE: To provide a semiconductor laser array module having high coupling efficiency by forming spherical faces in a lens shape by electric discharge machining at the front ends of a glass waveguide formed by photolithography.

CONSTITUTION: A buffer layer 26 and a core layer 27 are formed on an Si substrate 21. A clad layer 28 is formed by a flame deposition method thereon and is sintered, by which the glass waveguide is obtd. A WSi film 29 is formed by a sputtering method on this glass waveguide. A photoresist is applied on this WSi film 29 and the WSi film 29 is etched by using a mask having a rugged shape. The glass waveguide part is then etched on the basis of the WSi film 29 and thereafter, the WSi film 29 is etched. The end part of the glass waveguide of the Si substrate 21 is etched by wet etching to spatially project the projecting part 31 at the front end of the core 27. The end face of the glass waveguide of the projecting part 31 is then heated to 2000°C to melt the core layer 27, by which the lens-shaped projecting face is formed.