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Title:
PRODUCTION OF HEAT-CONDUCTIVE SILICONE RUBBER COMPOSITION
Document Type and Number:
Japanese Patent JP2590654
Kind Code:
B2
Abstract:

PURPOSE: To provide the subject composition having heat dissipation properties equivalent to those of conventional heat-conductive silicone rubbers and having flame retardancy on the UL94V-0 level.
CONSTITUTION: The objective process for producing a heat-conductive silicone rubber composition comprises: using an organopolysiloxane (A) represented by the average compositional formula: RnSiO(4-n)/2 (wherein R is an (un) substituted monovalent hydrocarbon group, and (n) is a positive number of 1.95-2.05) and having an average degree of polymerization of 300 or above, aluminum hydroxide (B) having a mean particle diameter of 10μm or below, at least one heat conductive filler (C) selected from among aluminum oxide, boron nitride and aluminum nitride, platinum or its compound (D) and a curing agent (E), components A and B are mixed together and heated to 100-200°C, components C, D and E are added to the obtained mixture, and the resulting mixture is agitated without heating.


Inventors:
NAKANO AKIO
YONEYAMA TSUTOMU
TOMIZAWA NOBUMASA
Application Number:
JP33144291A
Publication Date:
March 12, 1997
Filing Date:
November 20, 1991
Export Citation:
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Assignee:
SHINETSU CHEM IND CO
International Classes:
C08K3/08; C08K3/22; C08K3/28; C08K3/38; C08L83/04; H01B3/46; H01B7/295; (IPC1-7): C08L83/04; C08K3/08; C08K3/22; C08K3/28; C08K3/38; H01B3/46; H01B7/34
Attorney, Agent or Firm:
Takashi Kojima



 
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