Title:
PRODUCTION OF HIGHLY INTEGRATED LEAD FRAME
Document Type and Number:
Japanese Patent JPH05175389
Kind Code:
A
Abstract:
PURPOSE: To stably manufacture a multi-pin lead frame which has a wide wire bonding effective width for an inner lead by both pressing and etching.
CONSTITUTION: A lead frame is permitted to have at least an outer lead 4 and an inner lead 2 which is provided around a pad continuously from the outer lead. For the manufacturing of the lead frame, a photoresist film 9 is provided on a metal plate and a resist pattern is formed on the one plane of the photoresist film in the forming area of the inner lead 2 or the inner lead tip. Etching is performed from the one plane so as to etch the inner lead 2 or the tip of the inner lead and the outer lead 4 is formed by pressing.
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Inventors:
KUBOTA SHIGEAKI
TSUJIMOTO KEIICHI
TSUJIMOTO KEIICHI
Application Number:
JP36130791A
Publication Date:
July 13, 1993
Filing Date:
December 24, 1991
Export Citation:
Assignee:
MITSUI HIGH TEC
International Classes:
C23F1/00; H01L23/50; (IPC1-7): C23F1/00; H01L23/50