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Patent Searching and Data


Title:
PRODUCTION OF HOT-MELT ADHESIVE
Document Type and Number:
Japanese Patent JP61047774
Kind Code:
A
Abstract:

PURPOSE: The titled adhesive having instant adhesiveness and solvent resistance, providing bonded cloth with a soft feeling, by reacting a polyamide resin containing a terminal amino group and a specific molecular weight, with a terminal isocyanate group-containing alkoxysilane compound.

CONSTITUTION: A terminal amino group-containing polyamide resin having 2,000W20,000 (preferably 4,000W12,000) average molecular weight is melted under heating, and reacted with a terminal isocyanate group-containing alkoxysilane (e.g., addition product of hexamethylene diisocyanate, etc. and 3-aminopropyltriethoxysilane, etc.) in an equivalent ratio of the alkoxysilane compound to amino group of 0.5W1.2, to give the aimed adhesive. The adhesive has especially preferable softening point of 80W130°C.


Inventors:
Okada, Chiharu
Sakamoto, Yoshinobu
Application Number:
JP1984000168847
Publication Date:
March 08, 1986
Filing Date:
August 14, 1984
Export Citation:
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Assignee:
AGENCY OF IND SCIENCE & TECHNOL
International Classes:
C08G69/00; C08G69/42; C08G69/48; C09J177/00; D06M11/00; D06M13/513; C08G69/00; C09J177/00; D06M11/00; D06M13/00; (IPC1-7): C08G69/48; C09J3/16